IBM’s Zurich Research Lab recently demonstrated a huge breakthrough in CPU cooling technology at the BroadGroup Power and Cooling Summit in London. This new technology, known as “high thermal conductivity interface technology,” draws twice the amount of heat from CPUs as existing CPU cooling practices.

Why is this technology important? As CPU’s get faster, and smaller, they also get hotter. Have you ever seen how HUGE a heat sink is on a G5 CPU? Have you ever noticed how hot a MacBook Pro gets compared to a PowerBook? Cooling technology advancements like this are just as important as the new CPU’s we wish to cram into smaller and smaller spaces. This new IBM technology also provides a better way to insert the thermally conductive paste we use to transmit heat from the CPU to its heat sink. Check out the IBM press release.