Tessera Shows Technology To Make ‘Wafer-Level’ Digital Camera Modules
by DJ Neawedde | 11th June 2007
San Jose based Tessera Technologies has developed a new miniaturization of the camera to be integrated into mobile devices, for a more compact fit and tinier devices all around. The technology is called ‘OptiML WLC’ and it cuts the size of conventional camera modules down by over 50%, and also cuts down on costs. Tessera will ultimately license the technology, not actually build any modules themselves.
From Tessara: “Wafer level techniques are used to build thousands of lenses on a wafer at the same time. Multiple lens wafers are then aligned and bonded at the wafer level using Tessera’s OptiML(TM) WaferStack(TM) technology. The need for costly manual focusing is removed due to the accuracy of the WaferStack(TM) process. The bonded lens wafers are then diced into individual lens modules, and each lens module is mounted on top of a packaged image sensor.”
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Great now I can have a camera in my toilet — just joking.
June 12th, 2007 at 3:42 pm
Okay,nice work, but how many megapixels?
June 12th, 2007 at 4:26 pm
I saw your uPILR at Circuit Net magazine and I have a flip chip design application that requires interconnections. The density we need are bumps with a diameter of approx. 75 micron and a pitch of 150 to 200 micron. For underfill we need a standoff of 40-50 microns.
Please let me know if your new technology can be applied.
Thanks
November 27th, 2007 at 11:54 am